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Nano- and Micro-Mechanical Behavior Laboratory

Medium/Large-scale Mechanical Testing

* Standard height frame with maximum space between crosshead and base of 1260 mm and a minimum of 610 mm
* Instron 8800 control electronics
* ±50 kN (11,250 lbf) Dynacell load cell
* ±5 kN (1125 lbf) Dynamic load cell
* ±30 kN (6800 lbf, 6.8 kip) Fatigue Rated Hydraulic Wedge Tension Grips
* ±5 kN 3-point and 4-point bend fixtures
* Strain gage channel (1)
* COD gauge
* Complete Bluehill 2 Software Suite
* WaveMatrix dynamic testing software
* Instron Fracture Mechanics combination software package including da/dn (2490-906), KIC and CTOD (2490-907), JIC (2490-908)
* Video recording capability

* Load cells: ±500 N (100 lbf), ±30 kN (6800 lbf) tension/compression
* Displacement: μm – m range
* Strain gage channel (1)
* 30 kN (6800 lbf) Wedge Tension Grips
* compression platen
* 3-point and 4-point bend fixtures
* Complete Bluehill 2 Software Suite
* Video recording capability

* Load cell: ±100 kN (22,500 lbsf, 22.5 kip) tension/compression
* Displacement: μm – m range
* 50 kN (11,250 lbf) Wedge Tension Grips
* compression platen
* 3-point and 4-point bend fixtures
* Complete Bluehill 2 Software Suite
* Video recording capability

Small-scale Mechanical Testing

* Surface imaging with indentation tool
* Vertical loading: 1nN – 10 mN, Lateral loading: 3 μN – 10 mN
* Scratch testing, micro/nano-wear testing
* Heating to 150 °C
* Typical specimens: thin films, coatings, treated surfaces, small structures

* Simultaneous high resolution imaging and indentation, compression, bending, or tension
* Typical specimens: thin films, coatings, treated surfaces, multi-phase materials, small structures, nanowires
* Load resolution: ~1 μN, max load 10 mN
* Displacement: 5 nm – 50 μm

* Load resolution: <1 mN
* Displacement: 5 nm – 50 μm
* Ideal for tension and fatigue testing
* Typical specimens: thin films, fine wires

* Load cells: 250 g-f, 100 lbs., 1000 lbs. tension/compression
* Displacement: μm – mm range
* Tension, compression, 3 or 4 point bending
* Typical specimens: wires, foils, small structures (metal, ceramic, polymer)

Load cells: 250 g-f, 100 lbs., 1000 lbs. tension/compression
Displacement: μm – mm range
Penetration and puncture
Typical specimens: soft polymers, natural tissue

* 10 g-f load cell, 0.1 mN load resolution
* simultaneous load and contact resistance measurements

* N2, from 20 to 500 °C (293 to 773 K)
* In Vacuum, from –243 to 27 °C (30 to 300 K)
* In Vacuum, from –20 to 800 °C (253 to 1073 K)
* Typical specimens: thin films on Si wafer substrates

* Vacuum, from -190 to 500 °C (83 to 773 K)
* Thermal-expansion stress, stress relaxation
* Typical specimens: electrically conductive thin films on Si wafer substrates
* Capable of stress measurement in films of 20-100 nm thickness

* Vacuum, from 10 – 80 °C
* Typical specimens: electrically conductive thin films on Si wafer substrates
* Same sample geometry as membrane resonance; complementary technique
* Capable of stress measurement in films of nano-scale thickness

Thin Film Deposition

* 3 targets, 2” diameter, co-sputtering arrangement, RF and DC magnetron
* ideal for alloy deposition and multilayer stacks
* typical targets: Al, Ag, Au, Cu, In, Ir, Mo, Pt, Si, Ti, V, W, TiW, NiO, Al(2)O(3), Ni-7%V, CuSb, Pt-20%Ru, CuAl(x)
* base pressure typically 5 x 10-8 torr
* substrate bias, reactive sputtering (O2 and N2) and substrate heating capability
* 3” wafers and odd sized substrates possible

* 1 target, 3” diameter, RF and DC magnetron
* typical targets: Al, W, Ti
* base pressure typically 2 x 10-8 torr
* reactive sputtering (N2)
* 4” wafers and odd sized substrates possible

* Resistance heated, 3 boats
* typical materials: Cu, Al, Ni, Au
* base pressure typically 8 x 10-7 torr
* odd sized substrates possible

Surface Roughness Measurement

* Vertical range: 5 nm – 5 μm
* Horizontal range: 1 μm – 100 μm square
* Fluid cells
* Contact, Tapping Mode, STM

* Numerous AFM and SPM modes

* Numerous AFM and SPM modes
* Air, liquids
* TIRF optics

Sample Preparation

Related facilities at Lehigh University include:
The Electron Microscopy Center (http://www.lehigh.edu/~inmicro/)
The Sherman Fairchild Center for Solid State Studies
Microelectronics Laboratory (http://www.lehigh.edu/~incpn/fairchildlab.html)
Flat Panel Display Laboratory (www.ece.lehigh.edu/DRL)

 

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